is industry standard solder bar for Hi-Tech
electronics application where lead guarantee is max 0.05%
(500 ppm) their purity exceeds requirement for many
international standard,ASTMB32, JIS3282, QQ-S-571-F
and ANSI /J-STD-006.
is special specification solder bar which
low lead contain max 0.01%(100ppm). Their purity make
a more easier maintain solder composition in solder pot.
Because of 10 times of lead contain lower than RoHS
directive , this is more safe for production line.
made by a special process which
control inclusions of oxide and metallic and non- metallic
impurity. Low dross formation decrease dross formation,
increase joint strength by reduce dross inclusion, keep
surface tension low and safe cost by reducing dross
Packaging and the difference of bar’s size between Sn/Pb Solder Bar and lead free solder will protect you from operator error in your production line. KOKI lead free solder bar give you available shape to select to serve your need to prevent any error in continuous production line.
Cu Dissolution Rate
Cu dissolution rate in wave soldering pot
caused of defects problem. High Cu
dissolution make a terrible wetting ablility
in solder alloy. Following table is base
info for chosing recommended alloy.
Low Cu dissolution rate will reduce
contact time (Dwell Time) and Defects